The objective of this paintings research is the use of 4–point Low Frequencies measurements and so-called Van Der Pauw strategies in measuring the resistivity of copper thin films extensively used in the manufacture of planar additives such as inductor and others. Aligned configuration and rectangular configuration are typically used to measure skinny movies resistivity earlier than use. but variations in values among the 2 configurations consistent with frequency and thickness have been located in step with the authors. Measurements with both configurations on the equal skinny films need to make it possible to realize measurements evolution as a feature of frequency and thickness. The statement of Low Frequencies measuring frequency tiers of each configuration and the minimum thicknesses to have strong copper resistivity are the main contributions of the paper. This electric characterization is performed on copper skinny movies deposited on alumina substrates (50 mm × 20 mm × 635 μm) the usage of RF sputtering approach. Copper skinny movies with various thicknesses (3.3 μm, three.6 μm and 5.2 μm) had been characterized. Low-frequency electric characterization of these skinny films turned into carried out by way of 4–factor dimension method and using an HP 4284A type LCRmeter over the frequency variety of 20 Hz to 1 MHz. Van der Pauw’s technique changed into used to calculate resistivity. those studies allowed us to recognize impact of dimension configurations and impact of parameters along with frequency and thickness of the copper skinny Low Frequencies movies on resistivity.
In microelectronics, thin Frequencies movies are widely used for the manufacture of planar components which includes inductor and transformers and to shield these components against corrosion, provoke and insulate them electrically. Copper thin films are specially used because of the good conductivity of copper and its notably low production value. After the realization of thin movies, they’re subjected to a sequence of characterizations highlighting their diverse residences (physical, electrical, magnetic, mechanical, and so forth.). electrical characterization is the challenge of this studies paintings.
The few research that concentrate on measuring copper thin films resistivity by means of using 4–factor measurements are confined. The size of the conductivity of skinny copper films over some frequencies and for a thickness fee is proposed in [1]. the choice of frequencies and thickness are not justified. This paintings is continued in [2] but skinny movies resistivity is measured in line with radiofrequency sputtering deposition parameters. The correction coefficient used to Low Frequencies calculate resistivity by way of the Van der Pauw technique has been studied in [3]. And the tricky of desire between configurations became supplied in [4] however the solutions furnished can not justify a choice.
the general objective of this study is the electric characterization (indirect willpower of resistivity) of copper thin films in low frequencies (20 Hz to at least one MHz). This paintings need to spotlight the first-rate accuracy between the measurements made with the four–point aligned technique and the four–rectangular–factor approach referred to as Van der Pauw strategies. This characterization work is done on copper thin films deposited on alumina substrates. The prototypes are made at the Hubert Curien Laboratory using magnetron RF sputtering approach. The copper is deposited on a rectangular alumina mechanical aid (20 mm × 50 mm × 635 µm). The characterization of those skinny copper films of various thicknesses is done at the research laboratory of the country wide Institute of technology and technology of Abeche.